With the wide application of ceramic components in engineering, such as cutting tools, automotive valves, packaging (sealing) elements, bearings, piston rotors, etc., the role of advanced ceramic grinding in grinding has been increased. Improved performance and better efficiency of ceramic components in corresponding metals have many advantages. However, advantageous characteristics are accompanied by difficulties in the machining process, the main reason related to grinding is that these advanced ceramics and require the required precision and surface quality ground components have high hardness and stiffness. For brittle materials to obtain good surface finish and high dimensional precision grinding is an important process. It is a complex process involving complex interactions between a large number of variables, such as machine tools, grinding wheels, workpiece materials and operating counter meters. Precision ceramic components require strict performance of closing tolerances and surface finish, which can greatly affect the reliability of components during active surface polishing and grinding. There are a variety of factors that control dimensional accuracy and surface finish in grinding, so the development of analytical or empirical models to reliably predict machining performance becomes a key issue.
A uniformly continuous modeling must begin from the most basic physical process, which gives the process of individual abrasive particles interacting with the workpiece. This process must then be extended to the entire grinding wheel movement. Single gravel workpiece interactions can be characterized using undeformed chip thickness. This undeformed chip thickness is a variable that is often used to describe the quality of the ground surface and to evaluate the overall competitiveness of the grinding system. However, no such comprehensive model can predict the thickness range of undeformed chips under a wide range of operating conditions. The reason lies in the fact that many variables influence this process. Many of these variables are non-linear, interdependent, or difficult to quantify. Therefore, so far there is no fully feasible and experimental investigation can be very detailed but limited applicability of the available models [3]. Therefore, an attempt is made to develop a theoretical model for grinding silicon carbide and diamond abrasives to predict the undeformed chip thickness.
Despite different research efforts in ceramic grinding over the last two decades, there is a greater need to establish normative theoretical models for predicting undeformed chip thickness to improve product quality and increase and reduce processing cost creation. Because the surface produces a large number of cutting edges on the surface of the grinding wheel, grooves on the workpiece surface are produced by individual particles closely reflecting the display of geometric particles. Therefore, it is possible to evaluate undeformed chip thickness from the perspective of particle cue geometry. Because of the random nature of the size of these cutting edges on the wheel surface, the thickness of the undeformed chip cannot be predicted in a determined way. Because of this uncertainty, a probabilistic method to evaluate the undeformed chip thickness is more appropriate, so any attempt to estimate the undeformed chip thickness should be a natural probability.
In addition, the nature of the contact behavior between the grinding wheel and the workpiece during grinding is one of the main factors contributing to the quality of the ground workpiece. The importance of the original contact deformation in grinding has been recognized by researchers and industry practitioners. Geometrically, the deflection of local contact can affect the dimensional accuracy of the workpiece and the surface finish of the grounded component [4]. However, there are still many industries that use the "rule of thumb" or spark-finishing techniques to operate components that produce good surface quality and close space to tolerance. These operations can consume time and reduce equipment productivity. Therefore, the development of a new undeformed chip thickness model in grinding operations to reliably predict the effect of undeformed chip thickness on the original contact deformation must also be considered
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